IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermal stress characteristics of Cu interconnects using Air-Gap

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Lin Xiao-ling ; Hou Tong-xian ; Zhang Xiao-wen ; Yao Ruo-he
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 363 - 367
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582351
Regular:

Based on the elastic-plastic model, two-dimensional finite element analysis was used to analyze the Air-Gap Cu interconnects thermal stress behaviors. Firstly, the stress evolution with the... View More

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