IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effect of glass transition slope of underfill on solder joint fatigue life

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Zhen Zhang ; Park, S.B. ; Darbha, K. ; Master, R.N.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 350 - 355
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582348
Regular:

In flip chip microelectronic packages, solder bumps are used to connect the silicon die and package substrate for electrical functionality. However, due to the large mismatch of silicon and... View More

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