IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effects of bump metallurgies, underfill material and its cure process on package warpage

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Jieping Zhang ; Dongwen Gan ; Jinlin Wang ; Saikumar, J. ; Li-Hsin Chang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 330 - 336
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582342
Regular:

Excessive warpage in flip-chip packages would raise concerns of process stability and reliability as well as customer acceptance concerns, making it critical to understand the thermal-mechanical... View More

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