IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effect of solder volume on interfacial reactions between Sn3.5Ag0.75Cu solder balls and cu pad

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Luwei Liu ; Mingliang Huang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 299 - 304
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582332
Regular:

This study focused on the effect of solder volume on the interfacial reaction between Sn3.5Ag0.75Cu solder balls and Cu pads on PCB after various reflow soldering times. The diameters of the... View More

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