IEEE - Institute of Electrical and Electronics Engineers, Inc. - Millimeter wave technique for non-destructive Si wafer homogeneity characterization

2010 International Kharkov Symposium on Physics and Engineering of Microwaves, Millimeter and Submillimeter Waves (MSMW)

Author(s): Laurinavic̆ius, A. ; Derkach, V.N. ; Anbinderis, T.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2010
Conference Location: Kharkiv, Ukraine, Ukraine
Conference Date: 21 June 2010
Page(s): 1 - 4
ISBN (CD): 978-1-4244-7898-9
ISBN (Electronic): 978-1-4244-7899-6
ISBN (Paper): 978-1-4244-7900-9
DOI: 10.1109/MSMW.2010.5546091
Regular:

Millimeter wave vector analyzer technique for non-destructive Si wafer homogeneity characterization according to resistivity distribution on the wafer area is presented. The operation of this... View More

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