IEEE - Institute of Electrical and Electronics Engineers, Inc. - Demonstration of a reliable high-performance and yielding Air gap interconnect process

2010 IEEE International Interconnect Technology Conference - IITC

Author(s): Yoo, H.J. ; Balakrishnan, S. ; Bielefeld, J. ; Harmes, M. ; Hiramatsu, H. ; King, S. ; Kobrinsky, M. ; Krist, B. ; Reese, P. ; RamachandraRao, V. ; Singh, K. ; Suri, S. ; Ward, C.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2010
Conference Location: Burlingame, CA, USA, USA
Conference Date: 6 June 2010
Page(s): 1 - 3
ISBN (CD): 978-1-4244-7677-0
ISBN (Electronic): 978-1-4244-7678-7
ISBN (Paper): 978-1-4244-7676-3
DOI: 10.1109/IITC.2010.5510708
Regular:

Capacitance coupling in copper low-k interconnects can be further reduced by implementing Air gaps in the intra-layer dielectric. This paper describes the evaluation of an integrated Air gap... View More

Advertisement