IEEE - Institute of Electrical and Electronics Engineers, Inc. - Quantifying LER to predict its impact on BEOL TDDB reliability at 20nm ½ pitch

2010 IEEE International Interconnect Technology Conference - IITC

Author(s): Demuynck, S. ; Roussel, P. ; Stucchi, M. ; Versluijs, J. ; Gishia, G.G. ; De Roest, D. ; Tökei, Z. ; Beyer, G.P.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2010
Conference Location: Burlingame, CA, USA, USA
Conference Date: 6 June 2010
Page(s): 1 - 3
ISBN (CD): 978-1-4244-7677-0
ISBN (Electronic): 978-1-4244-7678-7
ISBN (Paper): 978-1-4244-7676-3
DOI: 10.1109/IITC.2010.5510698
Regular:

We present results of a refined model that allows prediction of the influence of LER on the TDDB performance when scaling towards 20nm ½ pitch. The model is validated on 35nm ½ pitch... View More

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