IEEE - Institute of Electrical and Electronics Engineers, Inc. - A feasibility study of building structural deformation monitoring using Global Positioning System (GPS), terrestrial surveying technique (TST) and crack gauge measurement (CGM)

2010 6th International Colloquium on Signal Processing & its Applications (CSPA)

Author(s): Ibrahim, M.R. ; Jaafar, J. ; Yahya, Z. ; Samad, A.M.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2010
Conference Location: Malacca City, Malaysia, Malaysia
Conference Date: 21 May 2010
Page(s): 8
ISBN (CD): 978-1-4244-7120-1
ISBN (Electronic): 978-1-4244-7122-5
ISBN (Paper): 978-1-4244-7121-8
DOI: 10.1109/CSPA.2010.5545342
Regular:

Deformation of engineering structures is often monitored in order to ensure that the structure is exhibiting safe deformation behaviour. The deformation of high-rise building can be monitored... View More

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