IEEE - Institute of Electrical and Electronics Engineers, Inc. - A thermal design methodology for power SiGe HBTs with non-uniform emitter finger spacing

2010 International Conference on Microwave and Millimeter Wave Technology (ICMMT)

Author(s): Jin, D.Y. ; Zhang, W.R. ; Guan, B.L. ; Chen, L. ; Hu, N. ; Xiao, Y. ; Wang, R.Q.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2010
Conference Location: Chengdu, China, China
Conference Date: 8 May 2010
Page(s): 510 - 513
ISBN (CD): 978-1-4244-5706-9
ISBN (Electronic): 978-1-4244-5708-3
ISBN (Paper): 978-1-4244-5705-2
DOI: 10.1109/ICMMT.2010.5525230
Regular:

As an effective and feasible method, the technology of non-uniform emitter finger spacing has been used to alleviate the thermal effects and improve the uneven temperature profile in multi-finger... View More

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