IEEE - Institute of Electrical and Electronics Engineers, Inc. - Gold-Gold Interconnects to Copper Pillar using fast Thermal Compression Bonding using Non-conductive paste

2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010)

Author(s): Frye, D. ; Guino, R. ; Gupta, S. ; Sano, M. ; Sato, K. ; Iida, K.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2010
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 1 June 2010
Page(s): 427 - 430
ISBN (Electronic): 978-1-4244-6412-8
ISBN (Paper): 978-1-4244-6410-4
ISBN (Online): 978-1-4244-6411-1
ISSN (Paper): 0569-5503
ISSN (Online): 0569-5503
DOI: 10.1109/ECTC.2010.5490938
Regular:

Flip chip bonding requires a device to be flipped and attached to the bond pads or traces on the substrate. For lower pitch devices with large bond pads, this was accomplished using gravity reflow... View More

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