IEEE - Institute of Electrical and Electronics Engineers, Inc. - Assessment of residual damage in leadfree electronics subjected to multiple thermal environments of thermal aging and thermal cycling

2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010)

Author(s): Lall, P. ; Vaidya, R. ; More, V. ; Goebel, K. ; Suhling, J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2010
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 1 June 2010
Page(s): 206 - 218
ISBN (Electronic): 978-1-4244-6412-8
ISBN (Paper): 978-1-4244-6410-4
ISBN (Online): 978-1-4244-6411-1
ISSN (Paper): 0569-5503
ISSN (Online): 0569-5503
DOI: 10.1109/ECTC.2010.5490907
Regular:

Electronic systems are often stored for long periods prior to deployment in the intended environment. Aging has been previously shown to effect the reliability and constitutive behavior of... View More

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