IEEE - Institute of Electrical and Electronics Engineers, Inc. - 3D SiP module using TSV and novel solder bump maker

2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010)

Author(s): Hyun-Cheol Bae ; Kwang-Seong Choi ; Yong-Sung Eom ; Byeong-Ok Lim ; Ki-Jun Sung ; Sunghae Jung ; Byeung-Gee Kim ; In-Soo Kang ; Jong-Tae Moon
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2010
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 1 June 2010
Page(s): 1,637 - 1,641
ISBN (Electronic): 978-1-4244-6412-8
ISBN (Paper): 978-1-4244-6410-4
ISBN (Online): 978-1-4244-6411-1
ISSN (Paper): 0569-5503
ISSN (Online): 0569-5503
DOI: 10.1109/ECTC.2010.5490765
Regular:

In this paper, a 3D system in package (SiP) module using through silicon vias (TSV) and novel solder bump maker (SBM) has been presented. The SBM is a paste material which is composed of the... View More

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