IEEE - Institute of Electrical and Electronics Engineers, Inc. - Optimized TSV process using bottom-up electroplating without wafer cracks

2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010)

Author(s): Byeong-Ok Lim ; Kwang-Seong Choi ; Yong-Sung Eom ; Hyun-Cheol Bae ; Sunghae Jung ; Ki-Jun Sung ; Jong-Tae Moon
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2010
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 1 June 2010
Page(s): 1,642 - 1,646
ISBN (Electronic): 978-1-4244-6412-8
ISBN (Paper): 978-1-4244-6410-4
ISBN (Online): 978-1-4244-6411-1
ISSN (Paper): 0569-5503
ISSN (Online): 0569-5503
DOI: 10.1109/ECTC.2010.5490762
Regular:

In this paper, we propose the bottom-up electroplating without the additional process to resize the wafer for the fabricating the TSVs. It is also able to be the good solution for the wafer crack... View More

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