IEEE - Institute of Electrical and Electronics Engineers, Inc. - Novel on chip power distribution technique based on plant vein

2010 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)

Author(s): HuiFen Huang ; QingXin Chu ; Sy Liu ; JianKang Xiao
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2010
Conference Location: Beijing, China, China
Conference Date: 12 April 2010
Page(s): 354 - 357
ISBN (CD): 978-1-4244-5622-2
ISBN (Electronic): 978-1-4244-5623-9
ISBN (Paper): 978-1-4244-5621-5
DOI: 10.1109/APEMC.2010.5475855
Regular:

In this paper, novel fractal on chip power distribution technique has been developed. The novel structure is designed based on leaf vein. The simulated and measured results illustrate that our... View More

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