IEEE - Institute of Electrical and Electronics Engineers, Inc. - Radiated emission far-field propagation with multiple ground stitch locations within a printed circuit board

2010 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)

Author(s): Montrose, M.I.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2010
Conference Location: Beijing, China, China
Conference Date: 12 April 2010
Page(s): 297 - 300
ISBN (CD): 978-1-4244-5622-2
ISBN (Electronic): 978-1-4244-5623-9
ISBN (Paper): 978-1-4244-5621-5
DOI: 10.1109/APEMC.2010.5475805
Regular:

Printed circuit boards (PCB) exhibit numerous properties related to the development of common-mode currents created by digital components. When multiple devices are switching simultaneously, a... View More

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