IEEE - Institute of Electrical and Electronics Engineers, Inc. - Signal integrity analysis of embedded planar EBG Structures

2010 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)

Author(s): de Paulis, F. ; Raimondo, L. ; Orlandi, A.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2010
Conference Location: Beijing, China, China
Conference Date: 12 April 2010
Page(s): 330 - 333
ISBN (CD): 978-1-4244-5622-2
ISBN (Electronic): 978-1-4244-5623-9
ISBN (Paper): 978-1-4244-5621-5
DOI: 10.1109/APEMC.2010.5475786
Regular:

This work analyzes the impact on the signal quality and integrity of embedded planar electromagnetic bandgap structures. The power integrity properties of these structures are related to the... View More

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