IEEE - Institute of Electrical and Electronics Engineers, Inc. - Improving electromagnetic compatibility performance of packages and SiP modules using a conformal shielding solution

2010 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)

Author(s): Karim, N. ; Jingkun Mao ; Jun Fan
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2010
Conference Location: Beijing, China, China
Conference Date: 12 April 2010
Page(s): 56 - 59
ISBN (CD): 978-1-4244-5622-2
ISBN (Electronic): 978-1-4244-5623-9
ISBN (Paper): 978-1-4244-5621-5
DOI: 10.1109/APEMC.2010.5475724
Regular:

High-speed digital and wireless devices radiate unintentional electromagnetic noise, which can affect the normal operation of other devices within the same system, causing intra-system... View More

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