IEEE - Institute of Electrical and Electronics Engineers, Inc. - Electrical modelling of temperature distributions in on-chip interconnects, packaging, and 3D integration

2010 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)

Author(s): Lijun Jiang ; Chuan Xu ; Smith, H. ; Rubin, B. ; Deutsch, A. ; Caron, A.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2010
Conference Location: Beijing, China, China
Conference Date: 12 April 2010
Page(s): 625 - 628
ISBN (CD): 978-1-4244-5622-2
ISBN (Electronic): 978-1-4244-5623-9
ISBN (Paper): 978-1-4244-5621-5
DOI: 10.1109/APEMC.2010.5475701
Regular:

In this talk, we will introduce a novel methodology using existing electromagnetic modelling tools for interconnect and packaging structures to simulate and model the temperature distribution... View More

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