IEEE - Institute of Electrical and Electronics Engineers, Inc. - Modeling of noise coupling inside multilayer printed circuit boards using cavity model and segmentation technique

2010 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)

Author(s): Zhenwei Yu ; Jun Fan ; Connor, S. ; Archambeault, B. ; Drewniak, J.L.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2010
Conference Location: Beijing, China, China
Conference Date: 12 April 2010
Page(s): 321 - 324
ISBN (CD): 978-1-4244-5622-2
ISBN (Electronic): 978-1-4244-5623-9
ISBN (Paper): 978-1-4244-5621-5
DOI: 10.1109/APEMC.2010.5475649
Regular:

The power distribution network in a printed circuit board (PCB) is an effective path for high-speed digital noise. The noise can be coupled by overlapping power/ground areas or by vias passing... View More

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