IEEE - Institute of Electrical and Electronics Engineers, Inc. - On the mechanical properties of Cu 3 Sn intermetallic compound through molecular dynamics simulation and nanoindentation testing

2010 11th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Author(s): Wen-Hwa Chen ; Hsien-Chie Cheng ; Ching-Feng Yu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2010
Conference Location: Bordeaux, France, France
Conference Date: 26 April 2010
Page(s): 1 - 7
ISBN (CD): 978-1-4244-7025-9
ISBN (Electronic): 978-1-4244-7027-3
ISBN (Paper): 978-1-4244-7026-6
DOI: 10.1109/ESIME.2010.5464610
Regular:

Cu3Sn crystal is a well-known intermetallic compound (IMC), which is often observed at the interface of Sn solder and Cu metallization. It is generally recognized as the major cause of the failure... View More

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