IEEE - Institute of Electrical and Electronics Engineers, Inc. - Low profile heat pipe heat sink and green performance characterization for next generation CPU module thermal designs

2010 IEEE/CPMT 26th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)

Author(s): Marlin Vogel ; Guoping Xu ; David Copeland ; Sukhvinder Kang ; Brad Whitney ; George Meyer ; Kenya Kawabata ; Matt Conners
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 February 2010
Conference Location: Santa Clara, CA, USA
Conference Date: 21 February 2010
Page(s): 145 - 150
ISBN (CD): 978-1-4244-9459-0
ISBN (Electronic): 978-1-4244-9460-6
ISBN (Paper): 978-1-4244-9458-3
ISBN (Online): 978-1-4244-9461-3
ISSN (CD): 1065-2221
ISSN (Paper): 1065-2221
DOI: 10.1109/STHERM.2010.5444301
Regular:

Increasing thermal demands of high-end server CPUs require increased performance of air-cooling systems to meet industry needs. Improving the air-cooled heat sink thermal performance is one of the... View More

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