IEEE - Institute of Electrical and Electronics Engineers, Inc. - A novel vertical solder pump structure for through-wafer interconnects

23rd IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2010)

Author(s): Jiebin Gu ; W T Pike ; W J Karl
Sponsor(s): IEEE
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2010
Conference Location: Wanchai, Hong Kong, China
Conference Date: 24 January 2010
Page(s): 500 - 503
ISBN (Electronic): 978-1-4244-5764-9
ISBN (Paper): 978-1-4244-5761-8
ISBN (Online): 978-1-4244-5763-2
ISSN (Electronic): 1084-6999
ISSN (Paper): 1084-6999
DOI: 10.1109/MEMSYS.2010.5442457
Regular:

Through wafer interconnection is a critical technology for advanced packaging. Previously, we have proposed a solder pump technology which could complete the via filling through solder reflow.... View More

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