IEEE - Institute of Electrical and Electronics Engineers, Inc. - WLCSP and flipchip production using electroless NI/AU plating and wafer level solder sphere transfer technologies

2010 International Symposium on Advanced Packaging Materials: Microtech (APM)

Author(s): Zakel, E.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 February 2010
Conference Location: Cambridge, United Kingdom, United Kingdom
Conference Date: 28 February 2010
Page(s): 5 - 12
ISBN (CD): 978-1-4244-6758-7
ISBN (Electronic): 978-1-4244-6759-4
ISBN (Paper): 978-1-4244-6756-3
DOI: 10.1109/ISAPM.2010.5441389
Regular:

WLCSP bumps have traditionally been produced by dropping preformed solder spheres through a metal template onto silicon wafers using modified surface mount stencil printers [1]. The squeegee... View More

Advertisement