IEEE - Institute of Electrical and Electronics Engineers, Inc. - A wafer-level heterogeneous technology integration for flexible pseudo-SoC

2010 IEEE International Solid- State Circuits Conference - (ISSCC)

Author(s): Yamada, H. ; Onozuka, Y. ; Iida, A. ; Itaya, K. ; Funaki, H.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 February 2010
Conference Location: San Francisco, CA, USA, USA
Conference Date: 7 February 2010
Page(s): 146 - 147
ISBN (CD): 978-1-4244-6035-9
ISBN (Electronic): 978-1-4244-6036-6
ISBN (Paper): 978-1-4244-6033-5
ISSN (CD): 0193-6530
ISSN (Paper): 0193-6530
DOI: 10.1109/ISSCC.2010.5434011
Regular:

The MEMS-LSI integration technologies that have been reported are mainly implemented for monolithic integrated System on Chip (SoC) by applying the advantages of process compatibility between MEMS... View More

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