IEEE - Institute of Electrical and Electronics Engineers, Inc. - Dynamic analysis of thermo-viscoelasticity in multi-physical systems: A bond graph approach

2016 IEEE International Conference on Systems, Man and Cybernetics (SMC)

Author(s): Amir Zanj ; Fangpo He ; Peter C. Breedveld
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2016
Conference Location: Budapest, Hungary
Conference Date: 9 October 2016
Page(s): 2,224 - 2,229
ISBN (Electronic): 978-1-5090-1897-0
ISBN (USB): 978-1-5090-1819-2
DOI: 10.1109/SMC.2016.7844569
Regular:

Controlling thermo-mechanical behavior of multi-physical systems has always been a challenge, as the general system behavior in this case is a result of complex energetic transactions between the... View More

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