IEEE - Institute of Electrical and Electronics Engineers, Inc. - Directional hybrid FEM-MoM for automotive system level simulation

2016 IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

Author(s): Bibhu Prasad Nayak ; Sreenivasulu Reddy Vedicherla ; Dipanjan Gope
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2016
Conference Location: San Diego, CA, USA
Conference Date: 23 October 2016
Page(s): 169 - 172
ISBN (Electronic): 978-1-5090-6110-5
ISBN (USB): 978-1-5090-2273-1
ISSN (Electronic): 2165-4115
DOI: 10.1109/EPEPS.2016.7835443
Regular:

Electromagnetic compatibility (EMC) issues are becoming increasingly important for the automotive industry. An accurate system level analysis is required from an early design stage for optimal... View More

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