IEEE - Institute of Electrical and Electronics Engineers, Inc. - An advanced 3D/2.5D integration packaging approach using double-self-assembly method with complex topography, and micropin-fin heat sink interposer for pressure sensing system

2016 IEEE International Electron Devices Meeting (IEDM)

Author(s): Yu-Chen Hu ; Chun-Pin Lin ; Hsiao-Chun Chang ; Yu-Tao Yang ; Chi-Shi Chen ; Kuan-Neng Chen
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2016
Conference Location: San Francisco, CA, USA
Conference Date: 3 December 2016
ISBN (Electronic): 978-1-5090-3902-9
ISBN (USB): 978-1-5090-3901-2
ISSN (Electronic): 2156-017X
DOI: 10.1109/IEDM.2016.7838380
Regular:

To cater complex topography sensors and circuit chips for smart lifestyle applications using Internet of Things (IoT), we develop a novel efficient double-self-assembly packaging approach... View More

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