IEEE - Institute of Electrical and Electronics Engineers, Inc. - Optimization of Biomass Curing Mold

2016 9th International Symposium on Computational Intelligence and Design (ISCID)

Author(s): Ning Tingzhou ; Shoulin Hou
Sponsor(s): IEEE Nanjing Comput. Intell. Chapter
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2016
Conference Location: Hangzhou, China
Conference Date: 10 December 2016
Volume: 1
Page(s): 42 - 45
ISBN (Electronic): 978-1-5090-3558-8
ISSN (Electronic): 2473-3547
DOI: 10.1109/ISCID.2016.1018
Regular:

In order to seek the optimal structure parameters of biomass curing mold, based on the FEA software ANSYS and the orthogonal experiment design method, the length to diameter ratio, the conicity of... View More

Advertisement