IEEE - Institute of Electrical and Electronics Engineers, Inc. - Multi-resolution co-design modeling: A Network-on-Chip model

2016 Winter Simulation Conference (WSC)

Author(s): Soroosh Gholami ; Hessam S. Sarjoughian
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2016
Conference Location: Washington, DC, USA
Conference Date: 11 December 2016
Page(s): 1,499 - 1,510
ISBN (CD): 978-1-5090-4484-9
ISBN (Electronic): 978-1-5090-4486-3
ISBN (USB): 978-1-5090-4485-6
ISSN (Electronic): 1558-4305
DOI: 10.1109/WSC.2016.7822201
Regular:

This paper proposes a multi-resolution co-design modeling approach where hardware and software parts of systems are loosely represented and composable. This approach is shown for Network-on-Chips... View More

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