IEEE - Institute of Electrical and Electronics Engineers, Inc. - Reconstitution of the three-dimensional temperature field inside the impenetrable solid

2016 Prognostics and System Health Management Conference (PHM-Chengdu)

Author(s): Jinwei Zhao ; Xinhong Hei ; Jingfei Fu ; Guirong Yan ; Longlei Dong ; Shilin Li ; Qi Wang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2016
Conference Location: Chengdu, China
Conference Date: 19 October 2016
Page(s): 1 - 6
ISBN (Electronic): 978-1-5090-2778-1
ISBN (USB): 978-1-5090-2777-4
ISSN (Electronic): 2166-5656
DOI: 10.1109/PHM.2016.7819864
Regular:

For reconstructing three-dimensional (3D) temperature field of small-scale and impenetrable solid, such as printed circuit board (PCB), a new method based on fuzzy relationships between... View More

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