IEEE - Institute of Electrical and Electronics Engineers, Inc. - Using silicone as protective layer stacked under bga for lowering temperature in PVD process

2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

Author(s): Shih Chun Chen ; Sheng I. Huang ; Ying Lin Chen ; Ta Hao Chang ; I. Fong Wu ; Chi Chung Yu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2016
Conference Location: Taipei, Taiwan
Conference Date: 26 October 2016
Page(s): 223 - 226
ISBN (Electronic): 978-1-5090-4769-7
ISSN (Electronic): 2150-5942
DOI: 10.1109/IMPACT.2016.7800076
Regular:

Package surface coating technology has been around for years. It can be used to protect assembly product from the interference of electromagnetic wave. The industry generally uses PVD sputter... View More

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