IEEE - Institute of Electrical and Electronics Engineers, Inc. - Shielding effectiveness modeling and measurement of multiple layers conformal shielding on system-in-package (SiP) module

2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

Author(s): Chih-Wen Kuo ; Hung-Chun Kuo ; Fu-Chen Chu ; Chen-Chao Wang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2016
Conference Location: Taipei, Taiwan
Conference Date: 26 October 2016
Page(s): 370 - 373
ISBN (Electronic): 978-1-5090-4769-7
ISSN (Electronic): 2150-5942
DOI: 10.1109/IMPACT.2016.7800063
Regular:

To suppress the electromagnetic interference (EMI) of advanced system-in-package (SiP) module, conformal shielding technology is discussed in recent years. Shielding effectiveness (SE) is the... View More

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