IEEE - Institute of Electrical and Electronics Engineers, Inc. - Crosstalk and SSO noise minimize optimization of high speed and high-pin-count 3D PKG-VERTICAL CONNECTION UNIT

2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

Author(s): Shineng Ma ; Xiang Yu ; Ye Bai ; Kaiyou Qian ; Chin-Tien Chiu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2016
Conference Location: Taipei, Taiwan
Conference Date: 26 October 2016
Page(s): 188 - 190
ISBN (Electronic): 978-1-5090-4769-7
ISSN (Electronic): 2150-5942
DOI: 10.1109/IMPACT.2016.7799979
Regular:

This paper discussed how to reduce cross talk and SSO noise to improve signal integrity for 3D PKG-VERTICAL CONNECTION UNIT. Due to the demand of high level IC integration, 3D packaging technology... View More

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