Association for Computing Machinery (ACM) - Power delivery in 3D packages: Current crowding effects, dynamic IR drop and compensation network using sensors

2016 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)

Author(s): Sukeshwar Kannan ; Mehdi Sadi ; Luke England
Publisher: Association for Computing Machinery (ACM)
Publication Date: 1 November 2016
Conference Location: Austin, TX, USA
Conference Date: 7 November 2016
Page(s): 1 - 6
ISBN (Electronic): 978-1-4503-4466-1
ISSN (Electronic): 1558-2434
DOI: 10.1145/2966986.2980094
Regular:

In 3D packages top-die power delivery is a not only limited by back-end of line (technology scaling), but also by the TSV integration scheme, the stacking method and the microbump current-carrying... View More

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