IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermal resistance measurements of building envelope components of the minang traditional house using the heat flow method

2016 International Seminar on Sensors, Instrumentation, Measurement and Metrology (ISSIMM)

Author(s): Wahyu Sujatmiko ; Fefen Suhedi ; Asnah Rumiawati
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2016
Conference Location: Malang, Indonesia
Conference Date: 10 August 2016
Page(s): 88 - 92
ISBN (Electronic): 978-1-5090-1128-5
DOI: 10.1109/ISSIMM.2016.7803729
Regular:

Thermal properties of building envelope is a fundamental key to building energy design or in evaluating the energy performance of an existing building. In-situ measurements are often constrained... View More

Advertisement