IEEE - Institute of Electrical and Electronics Engineers, Inc. - Modeling a liquid-solid insulation system used in a DC wet-mate connector

2016 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP)

Author(s): Mona Ghassemi ; Mattewos B. Tefferi ; Qin Chen ; Yang Cao
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2016
Conference Location: Toronto, ON, Canada
Conference Date: 16 October 2016
Page(s): 161 - 166
ISBN (Electronic): 978-1-5090-4654-6
ISBN (USB): 978-1-5090-4653-9
DOI: 10.1109/CEIDP.2016.7785647
Regular:

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