IEEE - Institute of Electrical and Electronics Engineers, Inc. - 3D Image Reconstruction of Monocrystalline Silicon Internal Defects Based on Ultrasonic Detection

2016 Sixth International Conference on Instrumentation & Measurement, Computer, Communication and Control (IMCCC)

Author(s): Wu Wei ; Qiu Zong Ming ; Huang Qiu Hong ; Zhao Min ; Liu Yu Bo
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 July 2016
Conference Location: Harbin, China
Conference Date: 21 July 2016
Page(s): 951 - 955
ISBN (CD): 978-1-5090-1194-0
ISBN (Electronic): 978-1-5090-1195-7
DOI: 10.1109/IMCCC.2016.154
Regular:

With the purpose of detecting the internal defects of monocrystalline silicon, an ultrasonic detection platform has been set up with the method of circle traversal detection combining transmission... View More

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