IEEE - Institute of Electrical and Electronics Engineers, Inc. - Towards self-alignment with copper pillars

2016 6th Electronic System-Integration Technology Conference (ESTC)

Author(s): Yezouma D. Zonou ; Olivier Castany ; Stephane Bernabe ; Philippe Arguel
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2016
Conference Location: Grenoble, France
Conference Date: 13 September 2016
Page(s): 1 - 6
ISBN (Electronic): 978-1-5090-1402-6
DOI: 10.1109/ESTC.2016.7764736
Regular:

In this paper we study the assembly of chips with copper pillars and SnAg bumps onto chips with Ti/Ni/Au pads. This with the aim to optimize self-alignment of micro optics and photonic chips.... View More

Advertisement