IEEE - Institute of Electrical and Electronics Engineers, Inc. - Comparative study of nickel-tin and copper-tin transient liquid phase bondings for power electronics packaging

2016 6th Electronic System-Integration Technology Conference (ESTC)

Author(s): Byung-Suk Lee ; Yong-Ho Ko ; Chang-Woo Lee ; Soong-Keun Hyun ; Jeong-Won Yoon
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2016
Conference Location: Grenoble, France
Conference Date: 13 September 2016
Page(s): 1 - 3
ISBN (Electronic): 978-1-5090-1402-6
DOI: 10.1109/ESTC.2016.7764719
Regular:

Recently, the eco-friendly vehicles such as Hybrid Electric Vehicle (HEV) and Electric Vehicle (EV) have been spotlighted. EV has power semiconductors which generate a lot of heat. So, the power... View More

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