IEEE - Institute of Electrical and Electronics Engineers, Inc. - Micro-welding using laser-generated ultrasound

2016 6th Electronic System-Integration Technology Conference (ESTC)

Author(s): Guangbin Dou ; Malcolm C. Gower ; Andrew S. Holmes
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2016
Conference Location: Grenoble, France
Conference Date: 13 September 2016
Page(s): 1 - 4
ISBN (Electronic): 978-1-5090-1402-6
DOI: 10.1109/ESTC.2016.7764718
Regular:

We demonstrate a novel micro-welding process in which laser-generated stress waves produced close to the bonding site assist in the formation of direct metal-metal bonds. The process has been used... View More

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