IEEE - Institute of Electrical and Electronics Engineers, Inc. - Low temperature Cu-Cu bonding using Ag nanoparticles by PVD

2016 6th Electronic System-Integration Technology Conference (ESTC)

Author(s): Zijian Wu ; Qian Wang ; Lin Tan ; Ziyu Liu ; Sun-Kyoung Seo ; Tae-Je Cho ; Jian Cai
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2016
Conference Location: Grenoble, France
Conference Date: 13 September 2016
Page(s): 1 - 6
ISBN (Electronic): 978-1-5090-1402-6
DOI: 10.1109/ESTC.2016.7764715
Regular:

A novel low temperature wafer-level Cu-Cu bonding method using Ag nanoparticles (NP) was proposed and realized in this paper. A bonding structure consisted of Cu bonding pads, TiW barrier/adhesive... View More

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