IEEE - Institute of Electrical and Electronics Engineers, Inc. - Impact of ELD layers in mechanical properties of microbumps for 3D stacking

2016 6th Electronic System-Integration Technology Conference (ESTC)

Author(s): Lin Hou ; Jaber Derakhshandeh ; Inge De Preter ; Kevin Vandersmissen ; Kenneth June Rebibis ; Andy Miller ; Eric Beyne ; Ingrid De Wolf
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2016
Conference Location: Grenoble, France
Conference Date: 13 September 2016
Page(s): 1 - 5
ISBN (Electronic): 978-1-5090-1402-6
DOI: 10.1109/ESTC.2016.7764712
Regular:

In this paper the influence of adding ELD barrier and capping layers in die shear strength of 3D stacked chips is discussed. Electroless NiB is used as barrier layer to prevent solder or UBM... View More

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