IEEE - Institute of Electrical and Electronics Engineers, Inc. - On the feasibility of die-to-wafer inorganic dielectric bonding

2016 6th Electronic System-Integration Technology Conference (ESTC)

Author(s): Teng Wang ; Arnita Podpod ; Giovanni Capuz ; Lan Peng ; Alain Phommahaxay ; Fumihiro Inoue ; Pieter Bex ; Vikas Dubey ; Kenneth June Rebibis ; Andy Miller ; Gerald Beyer ; Eric Beyne
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2016
Conference Location: Grenoble, France
Conference Date: 13 September 2016
Page(s): 1 - 5
ISBN (Electronic): 978-1-5090-1402-6
DOI: 10.1109/ESTC.2016.7764694
Regular:

A feasibility study of die-to-wafer (D2W) bonding of inorganic dielectric layers is conducted on common industrial tools in a typical cleanroom environment. With the help of an additional cleaning... View More

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