IEEE - Institute of Electrical and Electronics Engineers, Inc. - Au-Sn Solid-Liquid Interdiffusion (SLID) bonding for mating surfaces with high roughness

2016 6th Electronic System-Integration Technology Conference (ESTC)

Author(s): Hoang-Vu Nguyen ; Tung Manh ; Trym Eggen ; Knut E. Aasmundtveit
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2016
Conference Location: Grenoble, France
Conference Date: 13 September 2016
Page(s): 1 - 6
ISBN (Electronic): 978-1-5090-1402-6
DOI: 10.1109/ESTC.2016.7764691
Regular:

Au-Sn Solid-Liquid Interdiffusion (SLID) bonding of a standard piezoelectric material (PZT) to tungsten carbide (WC) has been investigated. Both materials have a bare bonding surface with an... View More

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