IEEE - Institute of Electrical and Electronics Engineers, Inc. - Mechanical behaviour and delamination mechanisms in temporary bonding

2016 6th Electronic System-Integration Technology Conference (ESTC)

Author(s): Karine Abadie ; Frank Fournel ; Pierre Montmeat ; Markus Wimplinger
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2016
Conference Location: Grenoble, France
Conference Date: 13 September 2016
Page(s): 1 - 6
ISBN (Electronic): 978-1-5090-1402-6
DOI: 10.1109/ESTC.2016.7764688
Regular:

This paper deals with the mechanical behaviour and the delamination mechanisms in temporary bonding. The presented work relies on developing a test vehicle in which a controlled delamination is... View More

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