IEEE - Institute of Electrical and Electronics Engineers, Inc. - Electro-thermal-mechanical analyses on stress in silver sintered power modules with different copper interconnection technologies

2016 6th Electronic System-Integration Technology Conference (ESTC)

Author(s): R. Dudek ; R. Doring ; M. Hildebrandt ; S. Rzepka ; S. Stegmeier ; S. Kiefl
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2016
Conference Location: Grenoble, France
Conference Date: 13 September 2016
Page(s): 1 - 8
ISBN (Electronic): 978-1-5090-1402-6
DOI: 10.1109/ESTC.2016.7764681
Regular:

Increasing demands for higher energy efficiency and operating at harsh environments lead to the development of new compact power electronics, which is complemented by new interconnection... View More

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