IEEE - Institute of Electrical and Electronics Engineers, Inc. - Non-destructive die attach test method for future robust packages - a proposal

2016 6th Electronic System-Integration Technology Conference (ESTC)

Author(s): Nadine Pflugler ; Reinhard Pufall ; Michael Goroll ; Bernhard Wunderle
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2016
Conference Location: Grenoble, France
Conference Date: 13 September 2016
Page(s): 1 - 4
ISBN (Electronic): 978-1-5090-1402-6
DOI: 10.1109/ESTC.2016.7764506
Regular:

In order to facilitate the evaluation the quality of layer compositions in terms of reliability, a new, non-destructive test method will be proposed in this paper. The new test method combines... View More

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