IEEE - Institute of Electrical and Electronics Engineers, Inc. - Development and fabrication of a thermally enhanced WLFO demonstrator

2016 6th Electronic System-Integration Technology Conference (ESTC)

Author(s): Andre Cardoso ; Hugo Barros ; Gusztav Hantos
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2016
Conference Location: Grenoble, France
Conference Date: 13 September 2016
Page(s): 1 - 7
ISBN (Electronic): 978-1-5090-1402-6
DOI: 10.1109/ESTC.2016.7764499
Regular:

The leading Fan-Out Wafer-Level Packaging (FOWLP) technology, WLFO by NANIUM, stemmed from Infineon's/Intel's embedded Wafer-Level BGA (eWLB) technology, has limited heat dissipation capability,... View More

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