IEEE - Institute of Electrical and Electronics Engineers, Inc. - Processing and reliability of bare die LED chip bonding on flexible plastic substrate

2016 6th Electronic System-Integration Technology Conference (ESTC)

Author(s): Arttu Huttunen ; Tuomas Happonen ; Marja Valimaki
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2016
Conference Location: Grenoble, France
Conference Date: 13 September 2016
Page(s): 1 - 5
ISBN (Electronic): 978-1-5090-1402-6
DOI: 10.1109/ESTC.2016.7764475
Regular:

Printed hybrid electronics combining traditional semiconductor devices and polymer substrates allows augmenting the performance of printed electronics. In this work, chip bonding on plastic... View More

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