IEEE - Institute of Electrical and Electronics Engineers, Inc. - Utilization of atmospheric plasma surface preparation to improve Copper plating processes

2016 6th Electronic System-Integration Technology Conference (ESTC)

Author(s): Eric Schulte ; Gilbert Lecarpentier
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2016
Conference Location: Grenoble, France
Conference Date: 13 September 2016
Page(s): 1 - 3
ISBN (Electronic): 978-1-5090-1402-6
DOI: 10.1109/ESTC.2016.7764469
Regular:

Many process steps in semiconductor manufacturing and packaging benefit from pristine surface preparation, such as descuming of photoresist, removal of native oxides, and surface activation. One... View More

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